Application: Touch panel, display device, thin film PV
Physical Characteristics
| Parameters | Typical Value |
| Production Methodology | Shaping up by powder metallurgy, and bonded into target with several segments. |
| Composition | Mo |
| Purity | >99.95wt% |
| Density | ≥10.0g/cm3 |
| Metal impurity | Fe ≤50ppm, Ni ≤50ppm, Cu ≤30ppm, Al ≤50ppm, Si ≤60ppm, W ≤100ppm, other ≤30ppm. Total ≤500ppm |
| Non-metallic impurity content | O: ≤100ppm C: ≤50ppm |
| Dimension | Maximal OD: 145~170mm, Length: 4000mm, Maximal single segment length: 1000mm. |
| Bonding ratio | >95% |
