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  • Home
  • About Sunlit
    Company Profile Corporate Culture Development History Patent Technology Quality Control R&D Center Enterprise Honor
  • Product Center
    Ceramic Material Metal Material Binding Service
  • Application Field
    Thin-film Solar Energy Display Device Low Radiation Glass Smart Glass Tools Decorative Plating Semiconductor Device
  • Media News
    News Information Trade Information
  • Careers
  • Contact Us
  • CHN
  • Thin-film Solar Energy

    The preparation of the solar cells with copper indium gallium selenide, cadmium telluride, amorphous silicon and gallium arsenide is used to convert solar energy into electricity. The target materials that mori provides include: i-zno, AZO, ZnSnO, MgZnO, ITO, Si, Mo, CuGa and CuInGa.

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  • Display Device

    Display Device For touch screen (TP), liquid crystal display (LCD), organic light-emitting diode (OLED) display and quantum dot display (QLED) provides key target material series: ITO, IZO, IGZO, TiOx, NbOx, Si, Mo, Cu, Al, Ti, Nb, Ag, W, etc.

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  • Low Radiation Glass

    The metal and metal oxide films deposited on the surface of the glass are coated with metal and metal oxide films, which are highly reflective of the visible light and the infrared. The target materials that mori provides include: AZO, JZOTM, ZnSnO, TIOx, ZrOx, SiAl, ZnSn, ZnAl, NiCr, SiAl, Ag, etc.

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  • Smart Glass

    Active control of light is achieved by using devices such as polymer dispersion liquid crystal (PDLC) and electrochromic (EC). Sen, can provide for these components magnetron sputtering deposition of transparent electrode layer, discoloration, lithium ion conducting layer, and lithium ion storage layer of target materials, including: AZO, JZOTM, ITO, WO3, NbOx, Si, Li, Li salt electrolyte, W, Mo, Nb, Cr, etc.

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  • Tools Decorative Plating

    It can greatly improve the performance and life of tool, die and friction wear parts. In the field of decorative coating, it has become a new trend to replace the traditional high pollution electroplating and electroplating with the physical coating. The target materials that mori can provide include: Cr, Al, Ti, Cu, WTi, capital, etc.

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  • Semiconductor Device

    In the process of integrated circuit manufacturing, the interconnect film and the barrier film are obtained by the method of magnetron sputtering. The target materials that mori can provide include: Al, Ti, Cu, W, Ta, etc.

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About Sunlit
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Quality Control
R&D Center
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Binding Service
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Display Device
Low Radiation Glass
Smart Glass
Tools Decorative Plating
Semiconductor Device
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